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1/43 tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 tsz22111 ? 14 ? 001 www.rohm.com datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. single-output ldo regulators 35v voltage resistance 1a ldo regulators bdxxc0a-c series bdxxc0aw-c series description the bdxxc0a-c series and the bdxxc0aw-c series are low-saturation regulators. the series output voltages are variable, 3.3v, 5.0v, 8.0v and 9.0v and packages are to252-3/5 and hrp5 and to263-3f/5f. this series has a built-in over-current protecti on circuit that prevents the destruction of the ic due to output short circuits and a thermal shutdown circuit that protects the ic from thermal damage due to overloading. key specifications 1) output current capability: 1a 2) output voltage: variable, 3.3v, 5.0v, 8.0v and 9.0v 3) high output voltage accuracy (ta=25c, to252-3/5, hrp5): 1% 4) low saturation with pdmos output 5) built-in over-current protec tion circuit that prevents the destruction of the ic due to output short circuits 6) built-in thermal shutdown circuit for protecting the ic from thermal damage due to overloading 7) low esr capacitor 8) to252-3/5, hrp5, to263-3f/5f package 9) aec-q100 qualified features ? supply voltage(vo 3.0v): vo+1.0v to 26.5v ? supply voltage(vo < 3.0v): 4.0v to 26.5v ? output voltage(bd00c0aw): 1.0v to 15.0v ? output current: 1a ? output voltage precision (ta=25c): 1% (to252-3/5, hrp5) (-40c ta +125c): 3% ? operating temperat ure range: -40c ta +125c applications automotive (body, audio system, navigation system, etc.) packages w(typ) x d(typ) x h(max) to252-5 6.50mm x 9.50mm x 2.50mm to252-3 6.50mm x 9.50mm x 2.50mm hrp5 9.395mm x 10.540mm x 2.005mm to263-5f 10.16mm x 15.10mm x 4.70mm to263-3f 10.16mm x 15.10mm x 4.70mm ordering part number b d x x c 0 a w x x x - c x x output voltage 00: variable 33: 3.3v 50: 5.0v 80: 8.0v 90: 9.0v current capacity c0a: 1a shutdown switch w: with switch none: without switch package fp: to252-3/5 hfp: hrp5 fp2: to263-3f/5f packaging and forming specification e2: embossed tape and reel (to252-3/5, to263-3f/5f) tr: embossed tape and reel (hrp5) downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2013 rohm co., ltd. all rights reserved. general precaution 1. before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohms products against warning, caution or note contained in this document. 2. all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sales representative. 3. the information contained in this document is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. downloaded from: http:///
2/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 lineup articles variable 3.3 5.0 8.0 9.0 package bdxxc0awfp-ce2 to252-5 reel of 2000 bdxxc0afp-ce2 - to252-3 reel of 2000 bdxxc0awhfp-ctr hrp5 reel of 2000 bdxxc0ahfp-ctr - hrp5 reel of 2000 bdxxc0awfp2-ce2 to263-5f reel of 500 bdxxc0afp2-ce2 - to263-3f reel of 500 typical application circuits output voltage variable type figure 1. typical application circuit output voltage variable type output voltage fixation type (with shutdown sw) figure 2. typical application circuit output voltage fixation type (with shutdown sw) output voltage fixation type (without shutdown sw) figure 3. typical application circuit output voltage fixation type (without shutdown sw) vcc l gn n.. v i vcc vcc gn v i vcc vcc l gn a v i vcc downloaded from: http:///
3/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 pin configurations/pin descriptions with shutdown sw (to252-5/hrp5/to263-5f) figure 4. pin configuratio ns (with shutdown sw) pin no. pin name function 1 ctl output control pin 2 vcc power supply pin 3 n.c. (n o t e 1) gnd n.c. pin (to252-5) gnd (hrp5/to263-5f) 4 vo output pin 5 adj n.c. (note 1) variable pin (bd00c0aw) n.c. pin (bd33/50/80/90c0aw) fin gnd gnd (note 1) n.c.pin can be open. because it isn't connect it inside of ic. without shutdown sw (to252-3/to263-3f) figure 5. pin descriptions (without shutdown sw) pin no. pin name function 1 vcc power supply pin 2 n.c. (n o t e 1) gnd n.c. pin (to252-3) gnd (to263-3f) 3 vo output pin fin gnd gnd (note 1) n.c.pin can be open. because it isn't connect it inside of ic. to252-5 (top view) t o 2 5 2- 5 12 3 4 5 to263-5f (top view) hrp5 (top view) hrp 5 t o 2 63 - 5 f fin 12 3 45 12345 fin t o 2 5 2- 3 1 2 3 to252-3 (top view) to263-3f to263-3f (top view) 123 fin downloaded from: http:///
4/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 without shutdown sw (hrp5) figure 6. pin descriptions (without shutdown sw) (hrp5) pin no. pin name function 1 vcc power supply pin 2 n.c. (note 1) n.c. pin 3 gnd gnd 4 n.c. n.c. pin 5 vo output pin fin gnd gnd (note 1) n.c.pin can be open. because it isn't connect it inside of ic. fin hrp5 (top view) hrp 5 12345 downloaded from: http:///
5/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 block diagrams bd00c0awfp/whfp/wfp2-c (output voltage variable type) to252-5/hrp5/to263-5f figure 7. block diagram bd00c0awfp/whfp/wfp2-c (output voltage variable type) bdxxc0awfp/whfp/wfp2-c (output voltage fixation type, with shutdown sw) to252-5/hrp5/to263-5f figure 8. block diagram bdxxc0awfp/whfp/wfp2-c (output voltage fixation type, with shutdown sw) downloaded from: http:///
6/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 bdxxc0afp/hfp/fp2-c (output voltage fixation type, without shutdown sw) to252-3/to263-3f figure 9. block diagram bdxxc0afp/fp2-c (output voltage fixation type, without shutdown sw) hrp5 figure 10. block diagram bdxxc0ahfp-c (output voltage fixation type, without shutdown sw) downloaded from: http:///
7/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta= 25 c ) parameter symbol ratings unit supply voltage (note 1) vcc -0.3 to +35.0 v output control voltage ( note 2 ) v ctl -0.3 to +35.0 v power dissipation pd 1.3 (to252-3/5) ( note 3 ) w 1.2 (hrp5) (note 4) w 1.3 (to263-3f/5f) ( note 5 ) w operating temperature range topr -40 to +125 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c (note 1) do not exceed pd. (note 2) the order of starting up power supply (vcc) and ctl pin doesn't have either in the problem within the range of the operation power-supply voltage ahead. (note 3) to252-3 : 114.3mm76.2mm 1.6mmt glass-epoxy pcb. if ta 25c, reduce by 10.4mw/c (note 4) to252-5 : 114.3mm76.2mm 1.6mmt glass-epoxy pcb. if ta 25c, reduce by 9.6mw/c (note 5) hrp5 : 114.3mm76.2mm1. 6mmt glass-epoxy pcb. if ta 25c, reduce by 15.2mw/c caution: operating the ic over the absolute maxi mum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit pr otection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (-40 c ta +125 c ) parameter symbol min max. unit supply voltage (vo 3.0v) vcc vo+1 26.5 v supply voltage (vo 3.0v) vcc 4.0 26.5 v startup voltage (io=0ma) vcc - 3.8 v output control voltage (with sw) v ctl 0 26.5 v output current io 0 1.0 a output voltage (bd00c0aw) ( note 1 ) vo 1.0 15.0 v (note 1) please refer to notes16 for use when you use bd00c0aw by output voltage 1.0v vo < 3.0v. electrical characteristics unless otherwise specified, -40c ta +125c, vcc=13.5v, io=0ma, v ctl =5.0v (with sw) the resistor of between adj and vo =56.7k ? , adj and gnd =10k ? (bd00c0aw) parameter symbol guaranteed limit unit conditions min. typ. max. shutdown current isd - 0 5 a circuit current ib - 0.5 2.5 ma adj terminal voltage (bd00c0awfp/whfp) vadj 0.742 0.750 0.758 v io=50ma, ta=25c adj terminal voltage (bd00c0aw) vadj 0.727 0.750 0.773 v io=50ma output voltage (bd33/50c0a(w9fp/(w)hfp) vo vo0.99 vo vo1.01 v io=200ma, ta=25c output voltage (bd33/50c0a(w)) vo vo0.97 vo vo1.03 v io=200ma output voltage (bd80/90c0a(w)fp/(w)hfp) vo vo0.99 vo vo1.01 v io=500ma, ta=25c output voltage (bd80/90c0a(w)) vo vo0.97 vo vo1.03 v io=500ma dropout voltage (bd00/50/80/90c0a(w)) vd - 0.3 0.5 v vcc=vo0.95,io=500ma ripple rejection (bd00/33/50c0a(w)) r.r. 45 55 - db f=120hz, input voltage ripple =1vms, io=100ma ripple rejection (bd80/90c0a(w)) r.r. 40 50 - db f=120hz, input voltage ripple =1vms, io=100ma line regulation reg.i - 20 80 mv vo+1.0v v cc 26.5v load regulation reg.l - vo 0.010 vo 0.020 v 5ma io 1a ctl on mode voltage (with sw) vthh 2.0 v active mode ctl off mode voltage (with sw) vthl 0.8 v off mode ctl bias current (with sw) i ctl 25 50 a downloaded from: http:///
8/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 thermal resistance parameter symbol min. max. unit to252-3/5 (note 1) junction to ambient ja 24.5 c/w junction to case (bottom) jc 3 c/w hrp5 (note 2) junction to ambient ja 19.2 c/w junction to case (bottom) jc 1 c/w to263-3f/5f (note 3) junction to ambient ja 15.6 c/w junction to case (bottom) jc 1 c/w (note 1) to252-3/5 mounted on 114.3mmx76. 2mmx1.6mmt glass-epoxy pcb based on jedec. (4-layer pcb: copper foil on the reverse side of pcb:74.2mmx74.2mm). (note 2) hrp5 mounted on 114.3mmx76.2mmx 1.6mmt glass-epoxy pcb based on jedec. (4-layer pcb: copper foil on the reverse side of pcb:74.2mmx74.2mm). (note 3) to263-3f/5f mounted on 114.3mmx76. 2mmx1.6mmt glass-epoxy pcb based on jedec. (4-layer pcb: copper foil on the reverse side of pcb:74.2mmx74.2mm). downloaded from: http:///
9/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data(vo=5.0v) bd00c0aw-c series unless otherwise specified, -40c ta +125c, vcc=13.5v, v ctl =5.0v, io=0ma, vo=5.0v (the resistor of between adj and vo =56.7k ? , adj and gnd =10k ? ) figure 11. circuit current (i feedback_r 75a) figure 12. shutdown current figure 13. line regulation (io=0ma) figure 14. line regulation (io=500ma) 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 circuit current:ib+i feedback_r [ma] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 3 6 9 12 15 18 0 2 4 6 8 10 12 14 16 18 20 22 24 26 shutdown current:isd [ a] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 0 2 4 6 8 101214161820222426 output voltage:vo [v] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 0 2 4 6 8 101214161820222426 output voltage:vo [v] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 downloaded from: http:///
10/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continue figure 15. load regulation figure 16. dropout voltage (vcc=vo0.95, 0ma io 1000ma) figure 17. ripple rejection (lo=100ma) figure 18. output voltage temperature characteristic 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 2400 output voltage:vo [v] output current:io [ma] ta= \ 40 ta=25 ta=125 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage : vd [mv] output current:io [ma] ta= \ 40 ta=25 ta=125 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] ta= \ 40 ta=25 ta=125 4.85 4.90 4.95 5.00 5.05 5.10 5.15 -40-20 0 20406080100120 output voltage: vo [v] ambient temperature: [ ] downloaded from: http:///
11/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continue figure 21. ctl voltage vs output voltage figure 22. thermal shutdown circuit characteristic 0 20 40 60 80 100 120 140 160 180 0 2 4 6 8 10 12 14 16 18 20 22 24 26 ctl bias current:i ctl [ a] control voltage: v ctl [v] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 02468101214161820222426 output voltage:vo [v] control voltage: v ctl [v] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 130 140 150 160 170 180 190 output voltage:vo [v] ambient temperature:ta [ ] 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:ib+i feedback_r [ma] output current:io [ma] ta= \ 40 ta=25 ta=125 figure 19. circuit current (0ma io 1000ma, (ifeedback_r 75a) figure 20. ctl voltage vs ctl current downloaded from: http:///
12/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 measurement setup for reference data bd00c0aw-c series (vo=5.0v) measurement setup for figure 11 measurement setup for figure 12 measurement setup for figure 13 measurement setup for figure 14 measurement setup for figure 15 measurement setup for figure 16 measurement setup for figure 17 measurement setup for figure 18 measurement setup for figure 19 measurement setup for figure 20 measurement setup for figure 21 measurement setup for figure 22 5v vcc ctl gnd adj vo 1f 1f 56.7k 10k 500ma 5v vcc ctl gnd adj vo 1f 1f 56.7k 10k 13.5v 1vrms 100ma 5v vcc ctl gnd adj vo 1f 1f 56.7k 10k 13.5v vcc ctl gnd adj vo 1f 1f 56.7k 10k 13.5v vcc ctl gnd adj vo 1f 1f 56.7k 10k 13.5v 5v downloaded from: http:///
13/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data bd33c0aw-c series unless otherwise specified, -40c ta +125c, vcc=13.5v, v ctl =5.0v, io=0ma 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 101214161820222426 circuit current:ib [ma] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 3 6 9 12 15 18 0 2 4 6 8 10 12 14 16 18 20 22 24 26 shutdown current:isd [ a] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 figure 23. circuit current figure 24. shutdown current figure 25. line regulation (io=0ma) figure 26. line regulation (io=500ma) 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 0 2 4 6 8 101214161820222426 output voltage:vo [v] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 downloaded from: http:///
14/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continue 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:ib [ma] output current:io [ma] ta= \ 40 ta=25 ta=125 figure 27. load regulation figure 28. ripple rejection (lo=100ma) figure 29. output voltage temperature characteristic figure 30. circuit current 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 2400 output voltage:vo [v] output current:io [ma] ta= \ 40 ta=25 ta=125 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 -40-20 0 20406080100120 output voltage: vo [v] ambient temperature: [ ] downloaded from: http:///
15/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continue 0 1 2 3 4 5 6 130 140 150 160 170 180 190 output voltage:vo [v] ambient temperature:ta [ ] 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] control voltage: v ctl [v] ta= \ 40 ta=25 ta=125 0 20 40 60 80 100 120 140 160 180 0 2 4 6 8 10 12 14 16 18 20 22 24 26 ctl bias current:i ctl [ a] control voltage: v ctl [v] ta= \ 40 ta=25 ta=125 figure 31. ctl voltage vs ctl current figure 32. ctl voltage vs output voltage figure 33. thermal shutdown circuit characteristic downloaded from: http:///
16/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data bd50c0aw-c series unless otherwise specified, -40c ta +125c, vcc=13.5v, v ctl =5.0v, io=0ma 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 101214161820222426 circuit current:ib [ma] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 3 6 9 12 15 18 0 2 4 6 8 10 12 14 16 18 20 22 24 26 shutdown current:isd [ a] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 figure 34. circuit current figure 35. shutdown current figure 36. line regulation (io=0ma) figure 37. line regulation (io=500ma) downloaded from: http:///
17/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continue 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 2400 output voltage:vo [v] output current:io [ma] ta= \ 40 ta=25 ta=125 figure 38. load regulation figure 39. dropout voltage (vcc=vo0.95v) figure 40. ripple rejection (lo=100ma) figure 41. output voltage temperature characteristic 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage : vd [mv] output current:io [ma] ta= \ 40 ta=25 ta=125 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] ta= \ 40 ta=25 ta=125 4.85 4.90 4.95 5.00 5.05 5.10 5.15 -40-20 0 20406080100120 output voltage: vo [v] ambient temperature: [ ] downloaded from: http:///
18/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continue 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:ib [ma] output current:io [ma] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 02468101214161820222426 output voltage:vo [v] control voltage: v ctl [v] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 1 3 01 4 01 5 01 6 01 7 01 8 01 9 0 output voltage:vo [v] ambient temperature:ta [ ] 0 20 40 60 80 100 120 140 160 180 0 2 4 6 8 10 12 14 16 18 20 22 24 26 ctl bias current:i ctl [ a] control voltage: v ctl [v] ta= \ 40 ta=25 ta=125 figure 42. circuit current figure 43. ctl voltage vs ctl current figure 44. ctl voltage vs output voltage figure 45. thermal shutdown circuit characteristic downloaded from: http:///
19/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data bd80c0aw-c series unless otherwise specified, -40c ta +125c, vcc=13.5v, v ctl =5.0v, io=0ma 0 1 2 3 4 5 6 7 8 9 10 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 7 8 9 10 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 101214161820222426 circuit current:ib [ma] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 3 6 9 12 15 18 0 2 4 6 8 10 12 14 16 18 20 22 24 26 shutdown current:isd [ a] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 figure 46. circuit current figure 47. shutdown current figure 48. line regulation (io=0ma) figure 49. line regulation (io=500ma) downloaded from: http:///
20/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continue 0 1 2 3 4 5 6 7 8 9 10 0 400 800 1200 1600 2000 2400 output voltage:vo [v] output current:io [ma] ta= \ 40 ta=25 ta=125 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage : vd [mv] output current:io [ma] ta= \ 40 ta=25 ta=125 figure 50. load regulation figure 51. dropout voltage (vcc=vo0.95v) figure 52. ripple rejection (lo=100ma) figure 53. output voltage temperature characteristic 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] ta= \ 40 ta=25 ta=125 7.76 7.81 7.86 7.91 7.96 8.01 8.06 8.11 8.16 8.21 -40-20 0 20406080100120 output voltage: vo [v] ambient temperature: [ ] downloaded from: http:///
21/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continue 0 20 40 60 80 100 120 140 160 180 0 2 4 6 8 101214161820222426 ctl bias current:i ctl [ a] control voltage: v ctl [v] ta= \ 40 ta=25 ta=125 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:ib [ma] output current:io [ma] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 7 8 9 10 02468101214161820222426 output voltage:vo [v] control voltage: v ctl [v] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 7 8 9 10 130 140 150 160 170 180 190 output voltage:vo [v] ambient temperature:ta [ ] figure 56. ctl voltage vs output voltage figure 57. thermal shutdown circuit characteristic figure 54. circuit current figure 55. ctl voltage vs ctl current downloaded from: http:///
22/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data bd90c0aw-c series unless otherwise specified, -40c ta +125c, vcc=13.5v, v ctl =5.0v, io=0ma 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 circuit current:ib[ma] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 1 2 3 4 5 6 7 8 9 10 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 0 3 6 9 12 15 18 0 2 4 6 8 10 12 14 16 18 20 22 24 26 shutdown current:isd [ a] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 figure 59. shutdown current figure 58. circuit current 0 1 2 3 4 5 6 7 8 9 10 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] ta= \ 40 ta=25 ta=125 figure 60. line regulation (io=0ma) figure 61. line regulation (io=500ma) downloaded from: http:///
23/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continue 0 1 2 3 4 5 6 7 8 9 10 0 400 800 1200 1600 2000 2400 output voltage:vo [v] output current:io [ma] ta= \ 40 ta=25 ta=125 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage : vd [mv] output current:io [ma] ta= \ 40 ta=25 ta=125 figure 62. load regulation figure 63. dropout voltage (vcc=vo0.95v) figure 64. ripple rejection (io =100ma) figure 65. output voltage temperature characteristic 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] ta= \ 40 ta=25 ta=125 8.73 8.83 8.93 9.03 9.13 9.23 -40-20 0 20406080100120 output voltage: vo [v] ambient temperature: [ ] downloaded from: http:///
24/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continue 0 1 2 3 4 5 6 7 8 9 10 130 140 150 160 170 180 190 output voltage:vo [v] ambient temperature:ta [ ] 0 1 2 3 4 5 6 7 8 9 10 02468101214161820222426 output voltage:vo [v] control voltage: v ctl [v] ta= \ 40 ta=25 ta=125 0 20 40 60 80 100 120 140 160 180 0 2 4 6 8 10 12 14 16 18 20 22 24 26 ctl bias current:i ctl [ a] control voltage: v ctl [v] ta= \ 40 ta=25 ta=125 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:ib [ma] output current:io [ma] ta= \ 40 ta=25 ta=125 figure 68. ctl voltage vs output voltage figure 69. thermal shutdown circuit characteristic figure 66. circuit current figure 67. ctl voltage vs ctl current downloaded from: http:///
25/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 measurement setup for reference data bdxxc0aw-c series(output voltage fixation type) 5v vcc ctl gnd n.c. vo 1f 100ma (1.0f) 2.2f measurement setup for figure 23, 34, 46 and 58 measurement setup for figure 24, 35, 47 and 59 measurement setup for figure 25, 36, 48 and 60 measurement setup for figure 26, 37, 49 and 61 measurement setup for figure 27, 38, 50 and 62 measurement setup for figure 39, 51 and 63 measurement setup for figure 28, 40, 52 and 64 measurement setup for figure 29, 41, 53 and 65 measurement setup for figure 30, 42, 54 and 66 measurement setup for figure 31, 43, 55 and 67 measurement setup for figure 32, 44, 56 and 68 measurement setup for figure 33, 45, 57 and 69 5v vcc ctl gnd n.c. vo 1f (1.0f) 2.2f (1.0f) 2.2f vcc ctl gnd n.c. vo 1f downloaded from: http:///
26/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 vcc gnd vcc gnd application examples ? applying positive surge to the vcc pin if the possibility exists that surges higher than 35.0v w ill be applied to the vcc pin, a zenar diode should be placed between the vcc pin and gnd pin as shown in the figure below. ? applying negative surge to the vcc pin if the possibility exists that negative surges lower than th e gnd are applied to the vcc pin, a schottky diode should be place between the vcc pin and gnd pin as shown in the figure below. ? implementing a protection diode if the possibility exists that a large induct ive load is connected to the output pin re sulting in back-emf at time of startup and shutdown, a protection diode should be placed as shown in the figure below. figure 70 figure 71 figure 72 vo downloaded from: http:///
27/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 thermal design to252-3 figure 73 to252-5 figure 74 ic mounted on rohm standard board based on jedec. board material: fr4 board size: 114.3 mm x 76.2 mm x 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm x 74.2 mm) condition : ja = 96.2 c/w, jc(top) = 22 c/w condition : ja = 24.5 c/w, jc(top) = 5 c/w, jc(bottom) = 3 c/w ic mounted o n rohm standard board based on jedec. board material: fr4 board size: 114.3 mm x 76.2 mm x 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm x 74.2 mm) condition : ja = 96.2 c/w, jc(top) = 22 c/w condition : ja = 24.5 c/w, jc(top) = 5 c/w, jc(bottom) = 3 c/w 5.1 w 1.3 w 0 1 2 3 4 5 6 0 25 50 75 100 125 150 power dissipation: pd[w] ambient temperature: ta[c] 5.1 w 1.3 w 0 1 2 3 4 5 6 0 25 50 75 100 125 150 power dissipation: pd[w] ambient temperature: ta[c] downloaded from: http:///
28/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 hrp5 figure 75 ic mounted on rohm standard board based on jedec. board material: fr4 board size: 114.3 mm x 76.2 mm x 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm x 74.2 mm) condition : ja = 104.2 c/w, jc(top) = 7 c/w condition : ja = 19.2 c/w, jc(top) = 2 c/w, jc(bottom) = 1 c/w 6.5 w 1.6 w 0 2 4 6 8 0 2 55 07 51 0 01 2 51 5 0 power dissipation: pd[w] ambient temperature: ta[c] downloaded from: http:///
29/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 to263-3f figure 76 to263-5f figure 77 ic mounted on rohm standard board based on jedec. board material: fr4 board size: 114.3 mm x 76.2 mm x 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm x 74.2 mm) condition : ja = 65.2 c/w, jc(top) = 19 c/w condition : ja = 15.6 c/w, jc(top) = 16 c/w, jc(bottom) = 1 c/w ic mounted o n rohm standard board based on jedec. board material: fr4 board size: 114.3 mm x 76.2 mm x 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm x 74.2 mm) condition : ja = 65.2 c/w, jc(top) = 19 c/w condition : ja = 15.6 c/w, jc(top) = 16 c/w, jc(bottom) = 1 c/w 8.0 w 1.9 w 0 2 4 6 8 10 0 2 55 07 51 0 01 2 51 5 0 power dissipation: pd[w] ambient temperature: ta[c] 8.0 w 1.9 w 0 2 4 6 8 10 0 2 55 07 51 0 01 2 51 5 0 power dissipation: pd[w] ambient temperature: ta[c] downloaded from: http:///
30/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 when operating at temperature more than ta=25c, please refer to the power dissipation characteristic curve shown in figure 73 to 77. the ic characteristics are closely related to the temperature at which the ic is used, so it is necessary to operate the ic at temperatures less than the maximu m junction temperature tjmax. figure. 73 to 77 shows the acceptable power dissipation c haracteristic curves of t he to252-3/5, hrp5 and to263-3f/5f packages. even when the ambient temperature (ta) is at normal te mperature (25c), the chip junc tion temperature (tj) may be quite high so please operate the ic at temperatures less than the acceptable power dissipation. the calculation method for power consumption pc(w) is as follows pc=(vcc vo)io+vccib acceptable loss pd pc solving this for load current io in order to operate within the acceptable loss (please refer to 19, 30, 42, 54 and 66 about ib.) it is then possible to find the maximum load current iomax with respect to the applied voltage vcc at the time of thermal desig n. calculation example) when to252-3 / to 252-5, ta=85c, vcc=13.5v, vo=5.0v calculation example) when hrp5, ta=85c, vcc=13.5v, vo=5.0v calculation example) when to263-3f / to263-5f, ta=85c,vcc=13.5v,vo=5.0v please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperatur e ranges. io pd vcc ib vcc vo vcc : input voltage vo : output voltage io : load current ib : circuit current io 311.2ma (ib 0.5ma) io 2.652 13.5ib 8.5 figure 75 ja=19.2c /w -52.0mw/c 25c =6.5w 85c =3.380w io 396.8ma (ib: 0.5ma) io 3.380 13.5ib 8.5 figure 76, 77 ja=15.6c /w -64mw/c 25c =8.0w 85c =4.160w io 488.6ma (ib: 0.5ma) io 4.160 13.5 ib 8.5 figure 73, 74 ja=24.5c /w -40.8mw/c 25c = 5.1w 85c =2.652w downloaded from: http:///
31/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuit figure 78 output voltage configuration method (bd00c0aw) please connect resistors r 1 and r 2 (which determines the output voltage) as shown in figure 79. please be aware that the offset due to the current that flows fr om the adj terminal becomes large when resistor values are large. due to this, resistance ranging from 5k ? to 10k ? is highly recommended for r 1 . vo adj(r 1 +r 2 )/r 1 figure 79 vcc terminal ctl terminal (with sw) vo terminal bd33/50/80/90c0a(w) r 1 (k ? ) (typ) r 2 (k ? ) (typ) r 3 (k ? ) (typ) bd33c0a(w) 10 34 15 bd50c0a(w) 56.6 bd80c0a(w) 5 48.3 20 bd90c0a(w) 55 bd00c0aw vo terminal adj terminal vcc l k y k y k y vcc v vcc v k y ic adj pin vo r 2 r 1 adj 0.75v (typ) downloaded from: http:///
32/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that t he internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capa citor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic duri ng assembly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. unused input pins input pins of an ic are oft en connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the outsi de can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction th rough the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
33/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automat ically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 14. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transit ioning of the protection circuit. 15. vcc pin insert a capacitor (vo 5.0v:capacitor 1f, 1.0 vo 5.0v:capacitor 2.2f) between the vcc and gnd pins. choose the capacitance according to the line between the power smoothing circuit and the vcc pin. selection of the capacitance also depends on the application. verify the application and allow for sufficient margins in the design. we recommend using a capacitor with excellent vo ltage and temperature characteristics. ceramic capacitor, low esr capacitor electric capacitor ic downloaded from: http:///
34/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 16. output pin in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd pin. we recommend a capacitor with a capacitance of more than 1 f(3.0v vo 15.0v). electrolytic, tantal um and ceramic capacitors can be used. we recommend a capacitor with a capacitance of more than 4.7 f(1.0v vo 3.0v). ceramic capacitors can be used. when selecting the capacitor ensure that the capacitance of more than 1 f(3.0v vo 15.0v) or more than 4.7 f(1.0v vo 3.0v) is maintained at the intended applied vo ltage and temperature range. due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. for selection of the capacitor refer to the cout_esr vs io data. the stable oper ation range given in the reference dat a is based on the standalone ic and resistive load. for actual applications the stable operating range is influenc ed by the pcb impedance, input supply impedance and load impedance. therefore verifica tion of the final operating environment is needed. when selecting a ceramic type capacitor, we recommend usi ng x5r, x7r or better with excellent temperature and dc-biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual applicat ion meets with the required specification. operatio n note 16 measurement circuit (bd00c0aw) . . . 8 a _ stable operating region unstable operating region 0.5 cin vs cout 3.0v vo 15.0v (reference data) cout_esr vs io 3.0v vo 15.0v (reference data) 4.0v vcc 26.5v 3.0v vo 15.0v -40c ta +125c 5k ? r 1 10k ? (bd00c0aw) cin=2.2f cin 100f 1f cout 100f 4.0v vcc 26.5v 1.0v vo < 1.5v -40c ta +125c 5k ? r 1 10k ? (bd00c0aw) 2.2f cin 100f 4.7f cout 100f 4.0v vcc 26.5v 3.0v vo 15.0v -40c ta +125c 0a io 1a 5k ? r 1 10k ? (bd00c0aw) 6.0v vcc 26.5v 5.0v vo 15.0v -40c ta +125c 0a io 1a 5k ? r 1 10k ? (bd00c0aw) 4.0v vcc 26.5v 1.0v vo < 3.0v -40c ta +125c 0a io 1a 5k ? r 1 10k ? (bd00c0aw) 4.0v vcc 26.5v 1.5v vo < 3.0v -40c ta +125c 5k ? r 1 10k ? (bd00c0aw) 2.2f cin 100f 4.7f cout 100f stable operating region cout f cin f stable operating region unstable operating region 2.2 4.7 . . . 8 a _ unstable operating region stable operating region 1 10 100 11 01 0 0 cout f cin f stable operating region 2.2 u ns t a bl e o p eratin g re g ion cout(f) cin f stable operating region . . . 8 a _ stable operating region unstable operating region cout_esr vs io 1.0v vo < 3.0v (reference data) cin vs cout 1.0v vo < 3.0v (reference data) vcc ctl gnd adj vo v ctl (5.0v) r 2 cin (1f or higher) cout (1f or higher) esr (0.001 or higher) io (rout) r 1 (5k to 10k ) v cc (4.0v to 26.5v) downloaded from: http:///
35/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued operation note 16 measurement circuit (bd00c0aw) 17. ctl pin do not set the voltage level on the ic's enable pin in betwe en vthh and vthl. do not leav e it floating or unconnected, otherwise, the output voltage would be unstable. 18. rapid variation in vcc voltage and load current ctl pin in case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a mosfet as output transistor. although the actual application might be the cause of the transients, the ic input voltage, output current and temperature are also possible causes. in case problems arise within the ac tual operating range, use countermeasures such as adju sting the output capacitance. 19. minute variation in output voltage in case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and load current, etc., use countermeasur es such as implementing filters. 20. in some applications, the vcc and pin potential might be reve rsed, possibly resulting in circuit internal damage or damage to the elements. for example, while the external capacitor is charged, the vcc shorts to the gnd. use a capacitor with a capacitance with less than 1000 f. we also recommend using reverse polarity diodes in series or a bypass between all pins and the vcc pin. 1 10 100 11 01 0 0 cout f cin f I 2.2 kI . . . 8 a _ kI I 4.0v vcc 26.5v 1.0v vo < 3.0v (cout and ceramic capacitor 10f is connected in parallel.) -40c ta +125c 5k ? r 1 10k ? (bd00c0aw) 2.2f cin 100f 1f cout 100f 4.0v vcc 26.5v 1.0v vo < 3.0v (cout and ceramic capacitor 10f is connected in parallel.) -40c ta +125c 0a io 1a 5k ? r 1 10k ? (bd00c0aw) cout_esr vs io 1.0v vo < 3.0v cout and ceramic capacitor 10f is connected in parallel. (reference data) cin vs cout 1.0v vo < 3.0v cout and ceramic capacitor 10f is connected in parallel. (reference data) vcc ctl gnd adj vo cin (1f or higher) v ctl (5.0v) v cc (4.0v to 26.5v) r 1 (5k to 10k ) r 2 ? io(rout) cout (1f or higher) esr(0.001 or higher) 10f downloaded from: http:///
36/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name to252-3 downloaded from: http:///
37/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name to252-5 downloaded from: http:///
38/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name hrp5 downloaded from: http:///
39/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name to263-3f downloaded from: http:///
40/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name to263-5f downloaded from: http:///
41/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 marking diagrams (top view) output voltage(v) part number marking 3.3 33c0ac 5.0 50c0ac 8.0 80c0ac 9.0 90c0ac output voltage(v) part number marking variable 00c0awc 3.3 33c0awc 5.0 50c0awc 8.0 80c0awc 9.0 90c0awc output voltage(v) shutdown sw part number marking variable with sw 00c0awhfpc 3.3 with sw 33c0awhfpc without sw 33c0ahfpc 5.0 with sw 50c0awhfpc without sw 50c0ahfpc 8.0 with sw 80c0awhfpc without sw 80c0ahfpc 9.0 with sw 90c0awhfpc without sw 90c0ahfpc to252-3 to252-3 (top view) part number marking lot numbe r to252-5 to252-5 (top view) part number marking lot number hrp5 hrp5 (top view) part number marking lot numbe r 1pin mark downloaded from: http:///
42/43 datasheet datasheet bdxxc0a-c series bdxxc0aw-c series tsz02201-0t2t0an00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.oct.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 output voltage(v) part number marking 3.3 33c0ac 5.0 50c0ac 8.0 80c0ac 9.0 90c0ac output voltage(v) part number marking variable 00c0awc 3.3 33c0awc 5.0 50c0awc 8.0 80c0awc 9.0 90c0awc to263-5f (top view) part number marking lot number 1pin to263-5f to263-3f (top view) part number marking lot numbe r 1pin to263-3f downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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